CORE NPU IP · PIM-LIKE NPU
PIM-like
NPU
Semunite NPU IP with Zero-skipping
Bring compute and memory closer.
Focus on necessary computation.
Zero-skipping added · Not yet taped out

CORE NPU IP · PIM-LIKE NPU
Semunite NPU IP with Zero-skipping
Bring compute and memory closer.
Focus on necessary computation.
Zero-skipping added · Not yet taped out

DATA MOVEMENT BETWEEN COMPUTE AND MEMORY
PIM-LIKE NPU DESIGN APPROACH
PIM-LIKE NPU IP
Semunite’s PIM-like NPU places compute units and memory close together to minimize data movement. We have enhanced the NPU IP with Zero-skipping to skip unnecessary computations involving zero values.
Zero-skipping added · Not yet taped out
The updated IP is planned for integration into a future VUI AI Chip tape-out.
SeM-V1 · NPU PPA · QuartzNet
49 GOPS · 15.4 mWINT8 · 4 NPU cores · 400 MHz / 0.9 V · Synopsys PrimeTime PX
NPU block · 0.43 mm² · 3.2 TOPS/W at 0.9 V. Efficiency of 5.0 TOPS/W at 0.7 V is estimated.
Read the CEO interview on technology and validation
We are preparing NPU IP extensions for SLM and Vision.
PRODUCT DETAIL · VUI EDGE AI
Our first Voice AI Chip, built around Semunite’s core NPU IP.
A low-power on-device Voice AI Chip development system for KWS, wake-word detection, and STT workloads, including compiler, runtime, profiling, and evaluation hardware.
AI model analysis and NPU mapping
Execution environment and performance analysis
Hardware validation and system integration
Application software and product integration
Execution path designed for continuous keyword and wake-word detection
Clustered compute and local SRAM reduce data movement
KWS, wake word, and STT run on the local device path
PRODUCT LINES
SEM PRODUCT · IN DEVELOPMENT
The image shows the SeM-V1 package concept and evaluation platforms. It does not represent finished SeM-V1 silicon or final specifications.
PRODUCT 02 · SeM-V2

PRODUCT 03 · SeM-V3

PRODUCT 04 · SeM-N1

SUAI LINE · TEST SILICON
A test chip built to move Semunite’s PIM-like NPU architecture into physical hardware validation.
SUAI is a test-chip line separate from SeM-V1. The photographed device is not SeM-V1 and does not represent final SeM-V1 commercial specifications.
We connect semiconductor design, software and commercialization to build your next product together.
The first AI Chip was taped out on Samsung Foundry’s 28 nm process. Further product milestones will be shared as development progresses.
Related interview (new tab)Received physical SUAI test chips in June 2026 following tape-out in January 2026. SUAI is a PIM-like NPU test chip, distinct from the SeM-V1 product.
Selected for the DIPS deep-tech startup program, supporting further semiconductor R&D and commercialization.
The companies plan to combine SOSLAB’s LiDAR and Semunite’s AI semiconductor technologies to explore applications in autonomous mobility, smart infrastructure and robotics, alongside joint demonstrations, R&D and business expansion.
The thinking behind Semunite, its PIM-like NPU, and the path toward on-device AI products.
Research on a complementary transformer involving Sangyeob Kim at KAIST, before Semunite was founded.
Review NPU design around your model’s operators, memory footprint and latency targets.
Request Model EvaluationDefine silicon and platform integration around your product, interfaces, power and area requirements.
Discuss System Integration