PIM-like NPU IPSemunite’s core AI compute technology
AI ChipBringing NPU technology into products
3.3 TOPSSUAI · INT8 peak · 200 MHz
7Korean patent applications pending

DATA MOVEMENT BETWEEN COMPUTE AND MEMORY

DATA MOVEMENT

Physical distance between compute and memory
Energy spent moving data
Workload-specific optimization

PIM-like NPU.
Compute meets memory.

PIM-LIKE NPU DESIGN APPROACH

CLOSER COMPUTE

Manual placement brings compute and memory closer
Minimize data movement
Optimize power, performance and area (PPA)

PIM-LIKE NPU IP

PIM-like NPU IP

Semunite’s PIM-like NPU places compute units and memory close together to minimize data movement. We have enhanced the NPU IP with Zero-skipping to skip unnecessary computations involving zero values.

  • Manual physical designPlace compute and memory close together to minimize data movement
  • PPA optimizationReduce energy consumption, computation time and chip area together
  • Zero-skippingAdded support for skipping unnecessary computations involving zero values

Zero-skipping added · Not yet taped out

The updated IP is planned for integration into a future VUI AI Chip tape-out.

SeM-V1 · NPU PPA · QuartzNet

49 GOPS · 15.4 mW

INT8 · 4 NPU cores · 400 MHz / 0.9 V · Synopsys PrimeTime PX

NPU block · 0.43 mm² · 3.2 TOPS/W at 0.9 V. Efficiency of 5.0 TOPS/W at 0.7 V is estimated.

Read the CEO interview on technology and validation
Explore architecture and specifications
PIM-like NPU concept combining PIM energy efficiency with NPU reconfigurability

PRODUCT DETAIL · VUI EDGE AI

SeM-V1

Our first Voice AI Chip, built around Semunite’s core NPU IP.

A low-power on-device Voice AI Chip development system for KWS, wake-word detection, and STT workloads, including compiler, runtime, profiling, and evaluation hardware.

  • Keyword Spotting (KWS)
  • Wake-Word Detection
  • Speech-to-Text (STT)
  • Compiler · Runtime · Profiling
SeM-V1 package concept with ZedBoard and Trenz evaluation platforms

Platform · From model integration to system evaluation

  1. SDK & Compiler

    AI model analysis and NPU mapping

  2. Runtime & Profiling

    Execution environment and performance analysis

  3. Evaluation Boards

    Hardware validation and system integration

  4. AI Solutions

    Application software and product integration

Always-On Voice Monitoring

Execution path designed for continuous keyword and wake-word detection

Energy-Efficient Inference

Clustered compute and local SRAM reduce data movement

On-Device Execution

KWS, wake word, and STT run on the local device path

PRODUCT LINES

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01 / 05

SEM PRODUCT · IN DEVELOPMENT

SeM-V1 Development Status

  • SeM-V1AI Chip development in progress
  • Power efficiencyProduct-specific validation in progress
  • 3 Voice WorkloadsKWS · Wake Word · STT
  • Compiler · Runtime · ProfilingDeployment software · evaluation hardware
  • 7 Patent ApplicationsKorean applications · pending

The image shows the SeM-V1 package concept and evaluation platforms. It does not represent finished SeM-V1 silicon or final specifications.

SeM-V1 package concept with ZedBoard and Trenz evaluation platforms
SeM-V1 package concept · AI accelerator evaluation hardware

From design to product. One team.

We connect semiconductor design, software and commercialization to build your next product together.

Meet Semunite

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Our milestones

View our history

First AI Chip tape-out

The first AI Chip was taped out on Samsung Foundry’s 28 nm process. Further product milestones will be shared as development progresses.

Related interview (new tab)

SUAI NPU test silicon secured

Received physical SUAI test chips in June 2026 following tape-out in January 2026. SUAI is a PIM-like NPU test chip, distinct from the SeM-V1 product.

Selected for DIPS

Selected for the DIPS deep-tech startup program, supporting further semiconductor R&D and commercialization.

Semunite in the news

All stories

NPU IP · Model Evaluation

Review NPU design around your model’s operators, memory footprint and latency targets.

Request Model Evaluation

AI Chip · Platform Partnerships

Define silicon and platform integration around your product, interfaces, power and area requirements.

Discuss System Integration

CONCEPT FILM · 23 SEC

SeM-V1 Always-On Voice Agent AI Chip

The supplied CES concept film was optimized for the web. It is a technology visualization, not live product footage.